Types of Memory Packages
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Types of Memory Packages

Types of Memory Packages Memory package is a small circuit board that contains memory chips. Single In-line Memory Module (SIMM), Dual In-Line Memory Module (DIMM), Small Outline Dual in-Line Memory Module (SODIMM) and Micro DIMM are some of the memory packages. These packages are the form factors of a RAM chip. The installation of a memory depends on the form factors of a RAM. A form factor is the size and shape of the memory packages

Types of Memory Packages

Memory package is a small circuit board that contains memory chips. Single In-line Memory Module (SIMM), Dual In-Line Memory Module (DIMM), Small Outline Dual in-Line Memory Module (SODIMM) and Micro DIMM are some of the memory packages. These packages are the form factors of a RAM chip. The installation of a memory depends on the form factors of a RAM. A form factor is the size and shape of the memory packages.

Single In-line Memory Module (SIMM)

Single In-line Memory Module (SIMM) is a small circuit board designed to hold memory chips. It contains pins for accepting data from the control circuit. These circuit boards or modules are known as packages. There are various SIMM packages available based on the number of pins it contains. For example, there are 30-pin packages and 72-pin packages.

The capacities of a 30-pin SIMM package are 256KB, 1MB, 2MB, 4MB, 8MB, and 16MB RAM. It contains 2, 4, or 8 data chips per module. A 30-pin SIMM package has a data bus width of 8 bits with 9-bit parity. Parity checks the accuracy of the data transmission. An odd parity and an even parity are the two modes of parity checking

A 72-pin Single In-line Memory Module (SIMM) package has 32-bit data width with 36-bit parity. PS/2 is another term used for -pin SIMM package. The capacities of a 72-pin package are 1 MB, 2MB, 4MB, 8MB, 16MB, 32MB, 64MB, and 128MB RAM. It contains 2, 4, 8, or 16 data chips per module. FPM DRAM uses a 72-pin SIMM package.

EDO DRAM may use either a 30-pin SIMM package or a 72-pin SIMM package.

A SIMM package is packed either in Small Outline J-Lead (SOJ) package or in Thin Small Outline Package (TSOP Type II).

The SOJ packages are surface mount packages. The pins of this package are shaped as letter come out of the chip. Due to this, the package is named as SOJ. The TSOP packages are also surface mount packages. These packages are thinner than the SOJ packages. These packages are used in the notebook computers.

SOJ and TSOP packages are the soldered DRAM chips. TSOP packages are 1mm in whereas SOJ packages are 3mm in height. Use 45 Degree slant while installing these packages.

Dual In-Line Memory Module (DIMM), Small Outline Dual in-Line Memory Module (SODIMM) and Micro DIMM are some other type of memory packages which will be discussed in details in my upcoming articles.

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